Invention Application
WO2011126973A2 FORMING METAL FILLED DIE BACK-SIDE FILM FOR ELECTROMAGNETIC INTERFERENCE SHIELDING WITH CORELESS PACKAGES
审中-公开
用于电磁干扰屏蔽的金属填充金属背面膜与无缝包装
- Patent Title: FORMING METAL FILLED DIE BACK-SIDE FILM FOR ELECTROMAGNETIC INTERFERENCE SHIELDING WITH CORELESS PACKAGES
- Patent Title (中): 用于电磁干扰屏蔽的金属填充金属背面膜与无缝包装
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Application No.: PCT/US2011/031079Application Date: 2011-04-04
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Publication No.: WO2011126973A2Publication Date: 2011-10-13
- Inventor: NALLA, Ravi K. , DELANEY, Drew
- Applicant: INTEL CORPORATION , NALLA, Ravi K. , DELANEY, Drew
- Applicant Address: 2200 Mission College Boulevard MS: RNB-4-150 Santa Clara, California 95052 US
- Assignee: INTEL CORPORATION,NALLA, Ravi K.,DELANEY, Drew
- Current Assignee: INTEL CORPORATION,NALLA, Ravi K.,DELANEY, Drew
- Current Assignee Address: 2200 Mission College Boulevard MS: RNB-4-150 Santa Clara, California 95052 US
- Agency: VINCENT, Lester J. et al.
- Priority: US12/755,201 20100406
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L21/60
Abstract:
Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods may include forming a cavity in a carrier material, attaching a die in the cavity, wherein a backside of the die comprises a metal filled DBF, forming a dielectric material adjacent the die and on a bottom side of the carrier material, forming a coreless substrate by building up layers on the dielectric material, and removing the carrier material from the coreless substrate.
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