发明申请
WO2011156221A2 WAFER BACKSIDE COATING PROCESS WITH PULSED UV LIGHT SOURCE
审中-公开
具有脉冲UV光源的WAFER背面涂层工艺
- 专利标题： WAFER BACKSIDE COATING PROCESS WITH PULSED UV LIGHT SOURCE
- 专利标题（中）： 具有脉冲UV光源的WAFER背面涂层工艺
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申请号： PCT/US2011/039044申请日： 2011-06-03
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公开(公告)号： WO2011156221A2公开(公告)日： 2011-12-15
- 发明人: GASA, Jeffrey , PHAN, Dung, Nghi , LEON, Jeffrey , HAJELA, Sharad , KONG, Shengqian
- 申请人： HENKEL CORPORATION , GASA, Jeffrey , PHAN, Dung, Nghi , LEON, Jeffrey , HAJELA, Sharad , KONG, Shengqian
- 申请人地址： One Henkel Way Rocky Hill, CT 06067 US
- 专利权人： HENKEL CORPORATION,GASA, Jeffrey,PHAN, Dung, Nghi,LEON, Jeffrey,HAJELA, Sharad,KONG, Shengqian
- 当前专利权人： HENKEL CORPORATION,GASA, Jeffrey,PHAN, Dung, Nghi,LEON, Jeffrey,HAJELA, Sharad,KONG, Shengqian
- 当前专利权人地址： One Henkel Way Rocky Hill, CT 06067 US
- 代理机构： GENNARO, Jane, E.
- 优先权： US61/352,584 20100608
- 主分类号： H01L23/12
- IPC分类号： H01L23/12
摘要：
A process for coating a semiconductor wafer with a coating composition comprises curing the coating with a pulsed UV light, thereby preventing delamination during reflow operations. In a particular embodiment, the coating composition comprises both epoxy and acrylate resins. The epoxy resin can be cured thermally; the acrylate resin is cured by UV irradiation.
IPC分类:
