Invention Application
- Patent Title: APPARATUS AND METHOD FOR TEMPERATURE CONTROL DURING POLISHING
- Patent Title (中): 抛光期间温度控制的装置和方法
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Application No.: PCT/US2011/040630Application Date: 2011-06-16
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Publication No.: WO2012021215A2Publication Date: 2012-02-16
- Inventor: CHEN, Hung Chih , HSU, Samuel Chu-Chiang , DANDAVATE, Gautam Shashank , KOOSAU, Denis M.
- Applicant: APPLIED MATERIALS, INC. , CHEN, Hung Chih , HSU, Samuel Chu-Chiang , DANDAVATE, Gautam Shashank , KOOSAU, Denis M.
- Applicant Address: 3050 Bowers Avenue Santa Clara, CA 95054 US
- Assignee: APPLIED MATERIALS, INC.,CHEN, Hung Chih,HSU, Samuel Chu-Chiang,DANDAVATE, Gautam Shashank,KOOSAU, Denis M.
- Current Assignee: APPLIED MATERIALS, INC.,CHEN, Hung Chih,HSU, Samuel Chu-Chiang,DANDAVATE, Gautam Shashank,KOOSAU, Denis M.
- Current Assignee Address: 3050 Bowers Avenue Santa Clara, CA 95054 US
- Agency: PATTERSON, B. Todd et al.
- Priority: US12/854,432 20100811
- Main IPC: H01L21/304
- IPC: H01L21/304
Abstract:
Embodiments of the present invention relate to apparatus and method for improve uniformity of a polishing process. Embodiments of the present invention provide a heating mechanism configured to apply thermal energy to a perimeter of a substrate during polishing, or a cooling mechanism configured to cool a central region of the substrate during polishing, or a biased heating mechanism configured to create a temperature step differential on a given radius of a polishing pad.
Information query
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