Invention Application
WO2012021215A3 APPARATUS AND METHOD FOR TEMPERATURE CONTROL DURING POLISHING
审中-公开
在抛光过程中用于温度控制的装置和方法
- Patent Title: APPARATUS AND METHOD FOR TEMPERATURE CONTROL DURING POLISHING
- Patent Title (中): 在抛光过程中用于温度控制的装置和方法
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Application No.: PCT/US2011040630Application Date: 2011-06-16
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Publication No.: WO2012021215A3Publication Date: 2012-04-12
- Inventor: CHEN HUNG CHIH , HSU SAMUEL CHU-CHIANG , DANDAVATE GAUTAM SHASHANK , KOOSAU DENIS M
- Applicant: APPLIED MATERIALS INC , CHEN HUNG CHIH , HSU SAMUEL CHU-CHIANG , DANDAVATE GAUTAM SHASHANK , KOOSAU DENIS M
- Assignee: APPLIED MATERIALS INC,CHEN HUNG CHIH,HSU SAMUEL CHU-CHIANG,DANDAVATE GAUTAM SHASHANK,KOOSAU DENIS M
- Current Assignee: APPLIED MATERIALS INC,CHEN HUNG CHIH,HSU SAMUEL CHU-CHIANG,DANDAVATE GAUTAM SHASHANK,KOOSAU DENIS M
- Priority: US85443210 2010-08-11
- Main IPC: H01L21/304
- IPC: H01L21/304
Abstract:
Embodiments of the present invention relate to apparatus and method for improve uniformity of a polishing process. Embodiments of the present invention provide a heating mechanism configured to apply thermal energy to a perimeter of a substrate during polishing, or a cooling mechanism configured to cool a central region of the substrate during polishing, or a biased heating mechanism configured to create a temperature step differential on a given radius of a polishing pad.
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