Invention Application
- Patent Title: THERMALLY CONDUCTIVE RESIN COMPOSITION
- Patent Title (中): 导热树脂组合物
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Application No.: PCT/US2011/054167Application Date: 2011-09-30
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Publication No.: WO2012044903A1Publication Date: 2012-04-05
- Inventor: SAGA, Yuji
- Applicant: E.I. DU PONT DE NEMOURS AND COMPANY , SAGA, Yuji
- Applicant Address: 1007 Market Street Wilmington, Delaware 19898 US
- Assignee: E.I. DU PONT DE NEMOURS AND COMPANY,SAGA, Yuji
- Current Assignee: E.I. DU PONT DE NEMOURS AND COMPANY,SAGA, Yuji
- Current Assignee Address: 1007 Market Street Wilmington, Delaware 19898 US
- Agency: HAMBY, William, H.
- Priority: US61/388,114 20100930
- Main IPC: C08K3/16
- IPC: C08K3/16 ; C08K3/40 ; C08K7/08 ; C08K9/00 ; C08K13/06 ; B29C45/14 ; B29C65/44 ; C08L65/02 ; C08L77/06
Abstract:
Thermally conductive resin compositions comprising polymer, calcium fluoride, fibrous filler and optionally, polymeric toughening agent are particularly useful for metal/polymer hybrid parts and as encapsulants.
Information query
