Invention Application
WO2012054149A3 APPARATUS AND METHOD FOR COMPENSATION OF VARIABILITY IN CHEMICAL MECHANICAL POLISHING CONSUMABLES
审中-公开
用于化学机械抛光耗材可变性补偿的装置和方法
- Patent Title: APPARATUS AND METHOD FOR COMPENSATION OF VARIABILITY IN CHEMICAL MECHANICAL POLISHING CONSUMABLES
- Patent Title (中): 用于化学机械抛光耗材可变性补偿的装置和方法
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Application No.: PCT/US2011051251Application Date: 2011-09-12
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Publication No.: WO2012054149A3Publication Date: 2012-06-14
- Inventor: DHANDAPANI SIVAKUMAR , JAIN ASHEESH , GARRETSON CHARLES C , MENK GREGORY E , TSAI STAN D
- Applicant: APPLIED MATERIALS INC , DHANDAPANI SIVAKUMAR , JAIN ASHEESH , GARRETSON CHARLES C , MENK GREGORY E , TSAI STAN D
- Assignee: APPLIED MATERIALS INC,DHANDAPANI SIVAKUMAR,JAIN ASHEESH,GARRETSON CHARLES C,MENK GREGORY E,TSAI STAN D
- Current Assignee: APPLIED MATERIALS INC,DHANDAPANI SIVAKUMAR,JAIN ASHEESH,GARRETSON CHARLES C,MENK GREGORY E,TSAI STAN D
- Priority: US40564010 2010-10-21
- Main IPC: H01L21/304
- IPC: H01L21/304 ; H01L21/66
Abstract:
Apparatus and methods for conditioning a polishing pad in a CMP system are provided. In one embodiment, an apparatus for polishing a substrate is provided. The apparatus includes a rotatable platen and a conditioner device coupled to a base. The conditioner device includes a shaft rotatably coupled to the base by a first motor. A rotatable conditioner head is coupled to the shaft by an arm. The conditioner head coupled to a second motor controlling rotation of the conditioner head. One or more measurement devices are provided that are operable to sense a rotational force metric of the shaft relative to the base and a rotational force metric of the conditioner head.
Information query
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