Invention Application
WO2012078541A2 METHODS FOR ANODIC BONDING MATERIAL LAYERS TO ONE ANOTHER AND RESULTANT APPARATUS
审中-公开
阳极键合材料层到另一个结果设备的方法
- Patent Title: METHODS FOR ANODIC BONDING MATERIAL LAYERS TO ONE ANOTHER AND RESULTANT APPARATUS
- Patent Title (中): 阳极键合材料层到另一个结果设备的方法
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Application No.: PCT/US2011/063377Application Date: 2011-12-06
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Publication No.: WO2012078541A2Publication Date: 2012-06-14
- Inventor: FENG, Jiangwei , OUYANG, Michael X , SIMPSON, Lynn Bernard , SUN, Yawei , TIAN, Lili
- Applicant: CORNING INCORPORATED , FENG, Jiangwei , OUYANG, Michael X , SIMPSON, Lynn Bernard , SUN, Yawei , TIAN, Lili
- Applicant Address: 1 Riverfront Plaza Corning, New York 14831 US
- Assignee: CORNING INCORPORATED,FENG, Jiangwei,OUYANG, Michael X,SIMPSON, Lynn Bernard,SUN, Yawei,TIAN, Lili
- Current Assignee: CORNING INCORPORATED,FENG, Jiangwei,OUYANG, Michael X,SIMPSON, Lynn Bernard,SUN, Yawei,TIAN, Lili
- Current Assignee Address: 1 Riverfront Plaza Corning, New York 14831 US
- Agency: SCHAEBERLE, Timothy, M
- Priority: US61/421,013 20101208
- Main IPC: B32B15/04
- IPC: B32B15/04
Abstract:
Methods and apparatus provide for: disposing an intermediate layer formed from at least one of: a metal, a conductive oxide, and combined layers of the metal and the conductive oxide, on one of a first material layer and a second material layer; and coupling the first and second material layers together via an anodic bond between the intermediate layer and the other of the first and second material layers.
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