Invention Application
WO2012100360A1 SENSOR CHIP COMPRISING A SPACER FOR PROTECTING THE SENSOR ELEMENT
审中-公开
传感器芯片，包括用于保护传感器元件的间隔器
- Patent Title: SENSOR CHIP COMPRISING A SPACER FOR PROTECTING THE SENSOR ELEMENT
- Patent Title (中): 传感器芯片，包括用于保护传感器元件的间隔器
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Application No.: PCT/CH2012/000019Application Date: 2012-01-26
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Publication No.: WO2012100360A1Publication Date: 2012-08-02
- Inventor: GRAF, Markus , STREIFF, Matthias , HUNZIKER, Werner
- Applicant: SENSIRION AG , GRAF, Markus , STREIFF, Matthias , HUNZIKER, Werner
- Applicant Address: Laubisrütistrasse 50 CH-8712 Stäfa CH
- Assignee: SENSIRION AG,GRAF, Markus,STREIFF, Matthias,HUNZIKER, Werner
- Current Assignee: SENSIRION AG,GRAF, Markus,STREIFF, Matthias,HUNZIKER, Werner
- Current Assignee Address: Laubisrütistrasse 50 CH-8712 Stäfa CH
- Agency: E. BLUM & CO. AG
- Priority: EP11000640.0 20110127
- Main IPC: B81B7/00
- IPC: B81B7/00
Abstract:
In a method for manufacturing a sensor chip a spacer (3) is arranged at the front side (11) of a substrate (1) at which front side (11) a sensing element (2) is arranged, too. Holes (14) are etched for building vias (15) extending through the substrate (1) between the front side (11) of the substrate (1) and its back side (12). After etching, the holes (14) are filled with conductive material to complete the vias (15). The spacer (3) provides protection to the sensing element (2) and the sensing chip throughout the manufacturing process.
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