Invention Application
WO2012125919A1 COMPOSITE LAMINATE HAVING A FLEXIBLE CIRCUIT BRIDGE AND METHOD OF MANUFACTURE THEREOF
审中-公开
具有柔性电路桥的复合层压板及其制造方法
- Patent Title: COMPOSITE LAMINATE HAVING A FLEXIBLE CIRCUIT BRIDGE AND METHOD OF MANUFACTURE THEREOF
- Patent Title (中): 具有柔性电路桥的复合层压板及其制造方法
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Application No.: PCT/US2012/029420Application Date: 2012-03-16
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Publication No.: WO2012125919A1Publication Date: 2012-09-20
- Inventor: FEENEY, Christopher, John
- Applicant: GKN AEROSPACE SERVICES STRUCTURES, CORP. , FEENEY, Christopher, John
- Applicant Address: 1000 Corporation Row Cromwell, CT 06416 US
- Assignee: GKN AEROSPACE SERVICES STRUCTURES, CORP.,FEENEY, Christopher, John
- Current Assignee: GKN AEROSPACE SERVICES STRUCTURES, CORP.,FEENEY, Christopher, John
- Current Assignee Address: 1000 Corporation Row Cromwell, CT 06416 US
- Agency: ARK, Daniel, J.
- Priority: US61/453,296 20110316
- Main IPC: H05K1/02
- IPC: H05K1/02 ; B64D15/12 ; H05B3/36
Abstract:
In a composite component having a laminate body, a conductive layer and a connector can be joined to one another using an intermediate flexible circuit. Among other things, this flexible circuit places the conductive layer and the connector in electrical communication with one another. Furthermore, during the forming process and because of its thinness, the flexible circuit integrates well with the layers of the laminate body and can accommodates some spatial displacement of the connector and conductive material relative to one another.
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