Invention Application
- Patent Title: ADAPTIVELY TRACKING SPECTRUM FEATURES FOR ENDPOINT DETECTION
- Patent Title (中): 用于端点检测的适应性追踪光谱特征
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Application No.: PCT/US2012/033969Application Date: 2012-04-17
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Publication No.: WO2012145336A2Publication Date: 2012-10-26
- Inventor: DAVID, Jeffrey Drue , BENVEGNU, Dominic J. , SWEDEK, Boguslaw A. , LEE, Harry Q.
- Applicant: APPLIED MATERIALS, INC. , DAVID, Jeffrey Drue , BENVEGNU, Dominic J. , SWEDEK, Boguslaw A. , LEE, Harry Q.
- Applicant Address: 3050 Bowers Avenue Santa Clara, California 95054 US
- Assignee: APPLIED MATERIALS, INC.,DAVID, Jeffrey Drue,BENVEGNU, Dominic J.,SWEDEK, Boguslaw A.,LEE, Harry Q.
- Current Assignee: APPLIED MATERIALS, INC.,DAVID, Jeffrey Drue,BENVEGNU, Dominic J.,SWEDEK, Boguslaw A.,LEE, Harry Q.
- Current Assignee Address: 3050 Bowers Avenue Santa Clara, California 95054 US
- Agency: GOREN, David, J.
- Priority: US13/090,972 20110420
- Main IPC: H01L21/304
- IPC: H01L21/304 ; H01L21/66
Abstract:
A method of controlling polishing includes polishing a substrate, monitoring a substrate during polishing with an in-situ monitoring system, generating a sequence of values from measurements from the in-situ monitoring system, fitting a non-linear function to the sequence of values, determining a projected time at which the non-linear function reaches a target value; and determining at least one of a polishing endpoint or an adjustment for a polishing rate based on the projected time.
Information query
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