发明申请
WO2012170505A1 LOW TEMPERATURE FSREABLE THICK FILM SILVER PASTE 审中-公开
低温FSREABLE厚膜银浆

LOW TEMPERATURE FSREABLE THICK FILM SILVER PASTE
摘要:
The present invention is directed to an electroconductive thick film paste composition comprising Ag and a Pb-free Bi-based glass frit both dispersed in an organic medium, wherein the paste is fireable at temperatures below 420°C. The paste is especially useful for forming electrodes on substrates such as glass or films, particularly electrochromic glass or films, that would be damaged by higher firing temperatures. The present invention is further directed to a device comprising an electrode formed from the paste composition and, in particular, to an electrochromic device comprising such an electrode.
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