Invention Application
WO2013009064A3 APPARATUS FOR FILLING A WAFER VIA WITH SOLDER AND HAVING A PRESSURE UNIT, AND METHOD FOR FILLING A WAFER VIA WITH SOLDER USING SAME
审中-公开
用于通过焊料填充水槽并具有压力单元的装置，以及用于通过使用焊接装置与焊接器一起填充的方法的装置
- Patent Title: APPARATUS FOR FILLING A WAFER VIA WITH SOLDER AND HAVING A PRESSURE UNIT, AND METHOD FOR FILLING A WAFER VIA WITH SOLDER USING SAME
- Patent Title (中): 用于通过焊料填充水槽并具有压力单元的装置，以及用于通过使用焊接装置与焊接器一起填充的方法的装置
-
Application No.: PCT/KR2012005440Application Date: 2012-07-10
-
Publication No.: WO2013009064A3Publication Date: 2013-03-14
- Inventor: YOO SE HOON , LEE CHANG WOO , KIM JUN KI , KIM JEONG HAN , KO YOUNG KI
- Applicant: KOREA INSTITIUTE OF IND TECHNOLOGY , YOO SE HOON , LEE CHANG WOO , KIM JUN KI , KIM JEONG HAN , KO YOUNG KI
- Assignee: KOREA INSTITIUTE OF IND TECHNOLOGY,YOO SE HOON,LEE CHANG WOO,KIM JUN KI,KIM JEONG HAN,KO YOUNG KI
- Current Assignee: KOREA INSTITIUTE OF IND TECHNOLOGY,YOO SE HOON,LEE CHANG WOO,KIM JUN KI,KIM JEONG HAN,KO YOUNG KI
- Priority: KR20110068845 2011-07-12
- Main IPC: H01L21/60
- IPC: H01L21/60
Abstract:
According to the present invention, an apparatus for filling a wafer via with a solder and having a pressure unit comprises: a solder bath which contains molten solder therein, which has an accommodation space with an open top, and which has an outlet portion formed at one side thereof in order to discharge air from the accommodation space; a fixing unit which fixes a wafer having a via formed on one surface thereof in said accommodation space so as to seal the accommodation space; and a pressure unit which presses the molten solder contained in the solder bath from the bottom so as to cause the molten solder to flow upwardly such that the molten solder fills into the via. Further, when in an apparatus for filling a wafer having a through-via with solder, the fixing unit provides a suction force to an upper surface of the wafer and fixes the wafer in the accommodation space, and the pressure unit presses the molten solder contained in the solder bath from the bottom so as to cause the molten solder to flow upwardly such that the molten soldier fills the via with the aid of the suction force of the fixing unit.
Information query
IPC分类:
