Invention Application
WO2013009853A3 ELECTRONIC ASSEMBLY INCLUDING DIE ON SUBSTRATE WITH HEAT SPREADER HAVING AN OPEN WINDOW ON THE DIE
审中-公开
电子组件，其中包括具有在DIE上的打开的窗口的散热器的基板上的DIE
- Patent Title: ELECTRONIC ASSEMBLY INCLUDING DIE ON SUBSTRATE WITH HEAT SPREADER HAVING AN OPEN WINDOW ON THE DIE
- Patent Title (中): 电子组件，其中包括具有在DIE上的打开的窗口的散热器的基板上的DIE
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Application No.: PCT/US2012046229Application Date: 2012-07-11
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Publication No.: WO2013009853A3Publication Date: 2013-04-04
- Inventor: YOKOYA SATOSHI , SIMMONS-MATTHEWS MARGARET ROSE
- Applicant: TEXAS INSTRUMENTS INC , TEXAS INSTRUMENTS JAPAN , YOKOYA SATOSHI , SIMMONS-MATTHEWS MARGARET ROSE
- Assignee: TEXAS INSTRUMENTS INC,TEXAS INSTRUMENTS JAPAN,YOKOYA SATOSHI,SIMMONS-MATTHEWS MARGARET ROSE
- Current Assignee: TEXAS INSTRUMENTS INC,TEXAS INSTRUMENTS JAPAN,YOKOYA SATOSHI,SIMMONS-MATTHEWS MARGARET ROSE
- Priority: US201113180085 2011-07-11
- Main IPC: H01L23/36
- IPC: H01L23/36
Abstract:
An electronic assembly (150) includes a workpiece (110), a through substrate via (TSV) die (120) including a substrate (105) and a plurality of TSVs (115), a topside (121) and a bottomside (122) having TSV connectors (113) thereon. The TSV die is attached to the workpiece with its topside on the workpiece. A heat spreader (130) having an inner open window (131) is on the bottomside of the TSV die. Bonding features (161) are coupled to the TSV connectors or include the TSV connectors themselves. The bonding features protrude from the inner open window to a height above a height of the top (132) of the heat spreader that allows a top die to be bonded thereto.
Information query
IPC分类:
