Invention Application
- Patent Title: APPARATUS AND METHOD OF ELECTRICAL TESTING FOR FLIP CHIP
- Patent Title (中): FLIP CHIP电气测试装置及方法
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Application No.: PCT/CN2012083282Application Date: 2012-10-22
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Publication No.: WO2013010512A3Publication Date: 2013-09-19
- Inventor: ZHOU XINSHU
- Applicant: SPREADTRUM COMM SHANGHAI CO , ZHOU XINSHU
- Assignee: SPREADTRUM COMM SHANGHAI CO,ZHOU XINSHU
- Current Assignee: SPREADTRUM COMM SHANGHAI CO,ZHOU XINSHU
- Priority: CN2012083282 2012-10-22
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L21/60 ; H01L23/485
Abstract:
An apparatus and methods for electrical testing for a flip chip are provided. A pad (100) on a flip chip (200) comprises: a first portion for contact with one or more tips of a probe device during a testing before a bumping on the pad; and a second portion for the bumping without contact with the one or more tips during the testing. The flip chip and manufacturing methods are also disclosed. The pads (100) on a flip chip (200) may be tested using a probe card while estimating the problems caused by the probe marks on the pads (100).
Information query
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