Invention Application
- Patent Title: HOT MELT COMPOSITION
- Patent Title (中): 热熔胶组合物
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Application No.: PCT/KR2012/006030Application Date: 2012-07-27
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Publication No.: WO2013024980A1Publication Date: 2013-02-21
- Inventor: HONG, Seung Gweon , JEON, Min Ho , CHUNG, Kwang Jin , CHUNG, Ki Nam , OK, Myung Ahn , SON, In Hun
- Applicant: SK INNOVATION CO.,LTD. , SK GLOBAL CHEMICAL CO., LTD. , HONG, Seung Gweon , JEON, Min Ho , CHUNG, Kwang Jin , CHUNG, Ki Nam , OK, Myung Ahn , SON, In Hun
- Applicant Address: 99, Seorin-dong Jongno-gu Seoul 110-110 KR
- Assignee: SK INNOVATION CO.,LTD.,SK GLOBAL CHEMICAL CO., LTD.,HONG, Seung Gweon,JEON, Min Ho,CHUNG, Kwang Jin,CHUNG, Ki Nam,OK, Myung Ahn,SON, In Hun
- Current Assignee: SK INNOVATION CO.,LTD.,SK GLOBAL CHEMICAL CO., LTD.,HONG, Seung Gweon,JEON, Min Ho,CHUNG, Kwang Jin,CHUNG, Ki Nam,OK, Myung Ahn,SON, In Hun
- Current Assignee Address: 99, Seorin-dong Jongno-gu Seoul 110-110 KR
- Agency: KWON, Oh-Sig et al.
- Priority: KR10-2011-0081965 20110818
- Main IPC: C09J163/00
- IPC: C09J163/00 ; C09J11/00
Abstract:
Provided is a hot melt adhesive composition including aliphatic polycarbonate. With the hot melt adhesive composition according to the present invention, the pyrolysis temperature is low, such that the harmful gas is not generated at the time of waste treatment, resulting in providing an excellent environmentally friendly product. In addition, the hot melt adhesive composition has the low melting temperature to thereby be usable at low temperature and exhibit sufficient adhesive strength.
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