Invention Application
WO2013052411A4 STUB MINIMIZATION FOR WIREBOND ASSEMBLIES WITHOUT WINDOWS
审中-公开
无需WINDOWS的WIREBOND组件的STUB最小化
- Patent Title: STUB MINIMIZATION FOR WIREBOND ASSEMBLIES WITHOUT WINDOWS
- Patent Title (中): 无需WINDOWS的WIREBOND组件的STUB最小化
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Application No.: PCT/US2012058273Application Date: 2012-10-01
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Publication No.: WO2013052411A4Publication Date: 2013-07-04
- Inventor: CRISP RICHARD DEWITT , ZOHNI WAEL , HABA BELGACEM , LAMBRECHT FRANK
- Applicant: INVENSAS CORP
- Assignee: INVENSAS CORP
- Current Assignee: INVENSAS CORP
- Priority: US201161542488 2011-10-03; US201261600271 2012-02-17; US201161542553 2011-10-03
- Main IPC: H01L25/065
- IPC: H01L25/065 ; H01L23/498
Abstract:
A microelectronic package (100) can include a microelectronic element (130) mounted face up on a first surface (108) of a substrate (102), with one or more columns (138, 139) of contacts (132) in a first direction (142) along the microelectronic element front face. Columns (104A, 104B, 106A, 106B) of terminals (105 107) exposed at a second surface (110) of the substrate extend in the first direction along surface (110). First terminals (105) exposed at surface (110) in a central region (112) thereof having width (152) not more than three and one-half times a minimum pitch (150) of the columns of terminals can be configured to carry address information usable to determine an addressable memory location. An axial plane of the microelectronic element can intersect the central region.
Information query
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