Invention Application
- Patent Title: FOLDING SO-DIMM SOCKET
- Patent Title (中): 折叠SO-DIMM插座
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Application No.: PCT/US2012/066896Application Date: 2012-11-28
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Publication No.: WO2013082189A2Publication Date: 2013-06-06
- Inventor: HACK, Paul J. , FUNAMURA, Joshua , ANASTAS, George V. , GAO, Zheng , SPRINGER, Greg , SHAHOIAN, Erik James
- Applicant: APPLE INC.
- Applicant Address: 1 Infinite Loop, M/S 169-3IPL Cupertino, California 95014 US
- Assignee: APPLE INC.
- Current Assignee: APPLE INC.
- Current Assignee Address: 1 Infinite Loop, M/S 169-3IPL Cupertino, California 95014 US
- Agency: ZIGMANT, J. Matthew et al.
- Priority: US61/564,809 20111129; US13/657,329 20121022
- Main IPC: G06F1/18
- IPC: G06F1/18 ; H05K7/14
Abstract:
Sockets that provide easy access for users to change cards while allowing the use of thinner device enclosures. One example provides a socket having two positions. When the socket is in an open state, the card may be oriented in a direction substantially away from the main logic board. When the socket is in a closed state, the card moves such that it is oriented at least closer to being in parallel to the main logic board.
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