Invention Application
- Patent Title: HIGH ASPECT RATIO STACKED MLCC DESIGN
- Patent Title (中): 高比例堆叠MLCC设计
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Application No.: PCT/US2012/068706Application Date: 2012-12-10
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Publication No.: WO2013090179A1Publication Date: 2013-06-20
- Inventor: MCCONNELL, John, E. , WEBSTER, Alan, P. , JONES, Lonnie, G. , RENNER, Garry, L. , BELL, Jeffrey
- Applicant: KEMET ELECTRONICS CORPORATION
- Applicant Address: P.O. Box 5928 Greenville, SC 29606 US
- Assignee: KEMET ELECTRONICS CORPORATION
- Current Assignee: KEMET ELECTRONICS CORPORATION
- Current Assignee Address: P.O. Box 5928 Greenville, SC 29606 US
- Agency: GUY, Joseph
- Priority: US13/323,916 20111213
- Main IPC: H01G4/232
- IPC: H01G4/232 ; H01G4/12
Abstract:
An improved passive electronic stacked component is described. The component has a stack of individual electronic capacitors and a first lead attached to a first side of the stack. A second lead is attached to a second side of the stack. A foot is attached to the first lead and extends inward towards the second lead. A stability pin is attached to one of the foot or the first lead.
Information query
