Invention Application
WO2014015316A2 THERMAL MANAGEMENT OF TIGHTLY INTEGRATED SEMICONDUCTOR DEVICE, SYSTEM AND/OR PACKAGE
审中-公开
紧密集成的半导体器件，系统和/或封装的热管理
- Patent Title: THERMAL MANAGEMENT OF TIGHTLY INTEGRATED SEMICONDUCTOR DEVICE, SYSTEM AND/OR PACKAGE
- Patent Title (中): 紧密集成的半导体器件，系统和/或封装的热管理
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Application No.: PCT/US2013/051392Application Date: 2013-07-19
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Publication No.: WO2014015316A2Publication Date: 2014-01-23
- Inventor: CHUA-EOAN, Lew G. , ZHANG, Rongtian
- Applicant: QUALCOMM INCORPORATED
- Applicant Address: Attn: International IP Administration 5775 Morehouse Drive San Diego, California 92121 US
- Assignee: QUALCOMM INCORPORATED
- Current Assignee: QUALCOMM INCORPORATED
- Current Assignee Address: Attn: International IP Administration 5775 Morehouse Drive San Diego, California 92121 US
- Agency: GALLARDO, Michelle S.
- Priority: US61/673,803 20120720; US13/741,755 20130115
- Main IPC: H01L23/34
- IPC: H01L23/34
Abstract:
Some implementations provide a semiconductor package that includes a first die and a second die adjacent to the first die. The second die is capable of heating the first die. The semiconductor package also includes a leakage sensor configured to measure a leakage current of the first die. The semiconductor package also includes a thermal management unit coupled to the leakage sensor. The thermal management unit configured to control a temperature of the first die based on the leakage current of the first die.
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