Invention Application
- Patent Title: OPTICAL SENSING ELEMENT ARRANGEMENT WITH INTEGRAL PACKAGE
- Patent Title (中): 具有整体包装的光学感测元件布置
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Application No.: PCT/US2013/066482Application Date: 2013-10-24
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Publication No.: WO2014066565A2Publication Date: 2014-05-01
- Inventor: BARLOW, Arthur, John
- Applicant: EXCELITAS TECHNOLOGIES SINGAPORE PTE. LTD. , EXCELITAS TECHNOLOGIES CORP.
- Applicant Address: 1 Fusionopolis Walk #11-02 Solaris South Tower Singapore 138628 SG
- Assignee: EXCELITAS TECHNOLOGIES SINGAPORE PTE. LTD.,EXCELITAS TECHNOLOGIES CORP.
- Current Assignee: EXCELITAS TECHNOLOGIES SINGAPORE PTE. LTD.,EXCELITAS TECHNOLOGIES CORP.
- Current Assignee Address: 1 Fusionopolis Walk #11-02 Solaris South Tower Singapore 138628 SG
- Agency: NIEVES, Peter, A.
- Priority: US13/661,274 20121026
- Main IPC: G01J5/04
- IPC: G01J5/04
Abstract:
A sensor assembly is disclosed that includes a hollow casing having a radiation entrance opening. A radiation-transmissive optic is at the radiation entrance opening. A substrate is inside and sealed against the hollow casing. An optical sensing element is coupled to the substrate and configured to sense radiation that has passed through the radiation-transmissive optic. A method of manufacturing the sensor assembly also is disclosed.
Information query
