Invention Application
- Patent Title: HIGH TEMPERATURE SHAPE MEMORY POLYMERS
- Patent Title (中): 高温形状记忆聚合物
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Application No.: PCT/US2013/070986Application Date: 2013-11-20
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Publication No.: WO2014081819A1Publication Date: 2014-05-30
- Inventor: WEISS, Robert , SHI, Ying , YOONESI, Mitra
- Applicant: THE UNIVERSITY OF AKRON , WEISS, Robert , SHI, Ying , YOONESI, Mitra
- Applicant Address: 302 E. Buchtel Common Akron, Ohio 44325 US
- Assignee: THE UNIVERSITY OF AKRON,WEISS, Robert,SHI, Ying,YOONESI, Mitra
- Current Assignee: THE UNIVERSITY OF AKRON,WEISS, Robert,SHI, Ying,YOONESI, Mitra
- Current Assignee Address: 302 E. Buchtel Common Akron, Ohio 44325 US
- Agency: WEBER, Ray et al.
- Priority: US61/728,545 20121120; US61/729,116 20121121
- Main IPC: B29C41/00
- IPC: B29C41/00
Abstract:
A shape memory composition includes a high temperature ionomer having a glass transition temperature or a melting temperature of 100°C or greater and a modulus at room temperature of 1 x 10 8 Pa or greater, the high temperature ionomer including a polymer with ionic units either within the backbone of the polymer or pendant to the backbone or both. The shape memory composition includes crystalline or glassy domains of a low molecular weight non-polymeric compound dispersed in the high temperature ionomer and interacting the ionic units of the high temperature ionomer to form a secondary network characterized by being a reversible network in that it is compromised by the heating of the low molecular weight non-polymeric compound to change out of its crystalline or glassy phase.
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