Invention Application
WO2014085063A1 METHODS AND APPARATUS FOR APPLYING ADHESIVES IN PATTERNS TO AN ADVANCING SUBSTRATE
审中-公开
用于将图案中的粘合剂应用于高级基板的方法和装置
- Patent Title: METHODS AND APPARATUS FOR APPLYING ADHESIVES IN PATTERNS TO AN ADVANCING SUBSTRATE
- Patent Title (中): 用于将图案中的粘合剂应用于高级基板的方法和装置
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Application No.: PCT/US2013/069381Application Date: 2013-11-11
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Publication No.: WO2014085063A1Publication Date: 2014-06-05
- Inventor: BROWN, Darrell, Ian , STRASEMEIER, John, Andrew
- Applicant: THE PROCTER & GAMBLE COMPANY
- Applicant Address: One Procter & Gamble Plaza Cincinnati, Ohio 45202 US
- Assignee: THE PROCTER & GAMBLE COMPANY
- Current Assignee: THE PROCTER & GAMBLE COMPANY
- Current Assignee Address: One Procter & Gamble Plaza Cincinnati, Ohio 45202 US
- Agency: GUFFEY, Timothy B.
- Priority: US13/685,817 20121127
- Main IPC: A61F13/15
- IPC: A61F13/15 ; B05C5/02 ; B05C11/10
Abstract:
Aspects of the methods and apparatuses (100) herein involve applying fluids onto an advancing substrate (106). The apparatuses (100) and methods herein may provide for the application of viscous fluids (130), such as adhesives, in pre-determined patterns to an advancing substrate (106). The fluid application apparatus may include a slot die applicator (102) and a substrate carrier (104). The slot die applicator(102) may include a slot opening (114), a first lip (116), and a second lip (118), the slot opening (114) located between the first lip (116) and the second lip (118). And the substrate carrier (104) may be adapted to advance the substrate (106) past the slot die applicator (102) as the slot die applicator (102) discharges adhesive onto the substrate (106). In operation, when a first surface (108) of the substrate (106) is disposed on the substrate carrier (104), the substrate carrier 104) advances a second surface (110) of the substrate past the slot opening (114) of the slot die applicator (104).
Information query