Invention Application
- Patent Title: THERMOCOUPLE CIRCUIT BASED TEMPERATURE SENSOR
- Patent Title (中): 基于热电偶电路的温度传感器
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Application No.: PCT/US2014/020161Application Date: 2014-03-04
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Publication No.: WO2014137994A1Publication Date: 2014-09-12
- Inventor: ROSENTHAL, Scott, Bruce
- Applicant: ROSENTHAL, Scott, Bruce
- Applicant Address: 6316 Distant Rock Path Columbia, MD 21045 US
- Assignee: ROSENTHAL, Scott, Bruce
- Current Assignee: ROSENTHAL, Scott, Bruce
- Current Assignee Address: 6316 Distant Rock Path Columbia, MD 21045 US
- Agency: TALBOT, C., Scott et al.
- Priority: US61/772,771 20130305
- Main IPC: G01K7/12
- IPC: G01K7/12
Abstract:
An apparatus is disclosed that includes a circuit board. The circuit board includes a thermally conductive surface, an A/D converter having an internal temperature sensor, and a thermally conductive pad thermally coupled to the temperature sensor and the thermally conductive surface. The apparatus further includes a thermocouple having a reference junction thermally coupled to the thermally conductive pad and the thermally conductive surface.
Information query
