Invention Application
- Patent Title: HIGH-PRESSURE HERMETIC TERMINAL
- Patent Title (中): 高压力终端
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Application No.: PCT/US2013/064788Application Date: 2013-10-14
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Publication No.: WO2014143179A1Publication Date: 2014-09-18
- Inventor: KHADKIKAR, Prasad S. , LAKNER, Gabriel
- Applicant: EMERSON ELECTRIC CO.
- Applicant Address: 8000 West Florissant Avenue St. Louis, Missouri 63136 US
- Assignee: EMERSON ELECTRIC CO.
- Current Assignee: EMERSON ELECTRIC CO.
- Current Assignee Address: 8000 West Florissant Avenue St. Louis, Missouri 63136 US
- Agency: UTYKANSKI, David P. et al.
- Priority: US61/788,762 20130315
- Main IPC: H01B17/30
- IPC: H01B17/30
Abstract:
A hermetic power terminal feed-through for use in high-pressure applications is disclosed as including a fused pin subassembly comprising a tubular reinforcing member and a current-conducting pin. The pin passes through the tubular reinforcing member and is fixed thereto by a fusible sealing material to create a hermetic seal. The fused pin subassembly is then joined and hermetically sealed to a terminal body. A method for manufacturing the high-pressure hermetic power terminal feed-through is also disclosed.
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