Invention Application
WO2014176242A1 METHODS AND APPARATUS USING ENERGIZED FLUIDS TO CLEAN CHEMICAL MECHANICAL PLANARIZATION POLISHING PADS
审中-公开
使用能量流体清洁化学机械平面抛光垫的方法和装置
- Patent Title: METHODS AND APPARATUS USING ENERGIZED FLUIDS TO CLEAN CHEMICAL MECHANICAL PLANARIZATION POLISHING PADS
- Patent Title (中): 使用能量流体清洁化学机械平面抛光垫的方法和装置
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Application No.: PCT/US2014/034959Application Date: 2014-04-22
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Publication No.: WO2014176242A1Publication Date: 2014-10-30
- Inventor: TANG, Jianshe , OSTERHELD, Thomas H. , REDEKER, Fred C. , MENK, Gregory E.
- Applicant: APPLIED MATERIALS, INC
- Applicant Address: 3050 Bowers Avenue Santa Clara, California 95054 US
- Assignee: APPLIED MATERIALS, INC
- Current Assignee: APPLIED MATERIALS, INC
- Current Assignee Address: 3050 Bowers Avenue Santa Clara, California 95054 US
- Agency: DUGAN, Brian M. et al.
- Priority: US13/869,307 20130424
- Main IPC: H01L21/304
- IPC: H01L21/304
Abstract:
Methods adapted to clean a chemical mechanical polishing (CMP) pad are disclosed. The methods include positioning an energized fluid delivery assembly over a CMP polishing pad; rotating the polishing pad on a platen; energizing a fluid within the energized fluid delivery assembly; applying the energized fluid to the polishing pad to dislodge slurry residue and debris; and removing the dislodged slurry residue and debris using a vacuum suction unit. Systems and apparatus for carrying out the methods are provided, as are numerous additional aspects.
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