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Invention Application
WO2014207590A3 METHOD OF MANUFACTURING AN ELECTRONIC STRUCTURE COMPRISING REDUCING SOLDER PAD TOPOLOGY DIFFERENCES BY PLANARIZATION AND CORRESPONDING ELECTRONIC STRUCTURE 审中-公开
通过平面化和相应的电子结构制造包含减少焊料平台拓扑差异的电子结构的方法

METHOD OF MANUFACTURING AN ELECTRONIC STRUCTURE COMPRISING REDUCING SOLDER PAD TOPOLOGY DIFFERENCES BY PLANARIZATION AND CORRESPONDING ELECTRONIC STRUCTURE
Abstract:
A technique is disclosed for causing the top surfaces of solder bumps on a chip (40) to be in the same plane to ensure a more reliable bond between the chip (40) and a substrate (62). The chip (40) is provided with solder pads (42, 44) that may have different heights. A dielectric layer (50) is formed between the solder pads (42, 44). A relatively thick metal layer (52) is plated over the solder pads (42, 44). The metal layer (52) is planarized to cause the top surfaces of the metal layer (52) portions over the solder pads (42, 44) to be in the same plane and above the dielectric layer (50). A substantially uniform thin layer of solder (58) is deposited over the planarized metal layer portions (52) so that the top surfaces of the solder bumps are substantially in the same plane, which may be substantially parallel to the top surface of the chip (40) or at an angle relative to the top surface of the chip (40). The chip (40) is then positioned over a substrate (62) having corresponding metal pads (64), and the solder (58) is reflowed or ultrasonically bonded to the substrate pads (64).
Abstract(Chinese):

公开了一种技术，用于使芯片（40）上的焊料凸起的顶表面位于同一平面中，以确保芯片（40）和衬底（62）之间的更可靠的结合。 芯片（40）设置有可能具有不同高度的焊盘（42,44）。 在焊盘（42,44）之间形成介电层（50）。 相对厚的金属层（52）被电镀在焊盘（42,44）上。 金属层（52）被平坦化，使得焊料焊盘（42,44）之上的金属层（52）的顶部表面位于同一平面内并在电介质层（50）的上方。 在平坦化的金属层部分（52）上沉积基本上均匀的薄层的焊料（58），使得焊料凸块的顶表面基本上处于与芯片的顶表面基本平行的同一平面（ 40）或相对于芯片（40）的顶表面成一定角度。 然后将芯片（40）定位在具有对应的金属焊盘（64）的衬底（62）上方，并且焊料（58）被回流或超声波结合到衬底焊盘（64）。

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