发明申请
- 专利标题： ADHERING AN ENCAPSULANT SHEET FOR A PHOTOVOLTAIC MODULE
- 专利标题（中）： 加入一个光伏模块的封面
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申请号： PCT/FI2014/050591申请日： 2014-07-22
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公开(公告)号： WO2015011342A1公开(公告)日： 2015-01-29
- 发明人: PANTSAR, Henrikki , LAMPINEN, Ville , SAVIKKO, Timo , NIEMINEN, Jarko , SAVISALO, Tuukka
- 申请人： CENCORP OYJ
- 申请人地址： Insinöörinkatu 8 Mikkeli, 50100 FI
- 专利权人： CENCORP OYJ
- 当前专利权人： CENCORP OYJ
- 当前专利权人地址： Insinöörinkatu 8 Mikkeli, 50100 FI
- 代理机构： PAPULA OY
- 优先权： FI20135790 20130723
- 主分类号： H01L31/048
- IPC分类号： H01L31/048 ; B32B38/18 ; B32B37/04 ; B32B3/26
摘要：
A method and a system for assembling a photovoltaic module (1 ) comprising a back sheet (2); a cover sheet (9); and a multitude of photovoltaic cells (6) between the back sheet (2) and the cover sheet (9), the photovoltaic cells (6) being separated from the back sheet (2) and the cover sheet (9) by sheets of encapsulant material (8). The method comprises using one of the back sheet (2) and the cover sheet (9) as a support sheet; heating the support sheet or parts of the support sheet to a temperature suitable for the encapsulant material (8) to adhere to the support sheet; and moving the support sheet to be in contact with one of the sheets of encapsulant material (8), causing the sheet of encapsulant material (8) to adhere to the support sheet.
IPC分类:
