Invention Application
- Patent Title: LONG-TERM PACKAGING FOR THE PROTECTION OF IMPLANT ELECTRONICS
- Patent Title (中): 用于保护植入电子的长期包装
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Application No.: PCT/US2014/031759Application Date: 2014-03-25
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Publication No.: WO2015020700A1Publication Date: 2015-02-12
- Inventor: TAI, Yu-Chong , CHANG, Han-Chieh
- Applicant: CALIFORNIA INSTITUTE OF TECHNOLOGY
- Applicant Address: Office of Technology Transfer M/C 210-85; Caltech Pasadena, CA 91125 US
- Assignee: CALIFORNIA INSTITUTE OF TECHNOLOGY
- Current Assignee: CALIFORNIA INSTITUTE OF TECHNOLOGY
- Current Assignee Address: Office of Technology Transfer M/C 210-85; Caltech Pasadena, CA 91125 US
- Agency: SNYDER, Joseph et al.
- Priority: US61/862,180 20130805; US14/142,180 20131227
- Main IPC: A61J1/00
- IPC: A61J1/00 ; B65D85/86 ; B65D85/90 ; A61F2/14 ; A61B19/02
Abstract:
The present invention provides a micropackaged device comprising: a substrate for securing a device; a corrosion barrier affixed to said substrate; optionally at least one feedthrough disposed in said substrate to permit at least one input and or at least one output line into said micropackaged device; and an encapsulation material layer configured to encapsulate the micropackaged device.
Information query
