Invention Application
- Patent Title: SYSTEM AND METHOD OF POLISHING A SURFACE
- Patent Title (中): 抛光表面的系统和方法
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Application No.: PCT/US2014/052759Application Date: 2014-08-26
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Publication No.: WO2015041813A1Publication Date: 2015-03-26
- Inventor: HSIA, Kangmin
- Applicant: HSIA, Kangmin
- Applicant Address: 3527 Providence Road Charlotte, NC 28211 US
- Assignee: HSIA, Kangmin
- Current Assignee: HSIA, Kangmin
- Current Assignee Address: 3527 Providence Road Charlotte, NC 28211 US
- Agency: CRISMAN, Douglas, J. et al.
- Priority: US14/095,926 20131203; US14/095,937 20131203; US61/879,080 20130917
- Main IPC: H01L21/304
- IPC: H01L21/304
Abstract:
A method of polishing a surface of an object disposed within a gas chamber is provided. The method includes filling the gas chamber with a discharging medium to a predefined pressure, applying a voltage between an electrode and the surface, calibrating a height of the electrode relative to the surface so as to establish electrical breakdown threshold criteria, and scanning the electrode with respect to the surface so as to sequentially position the electrode over a plurality of locations on the surface, each location characterized by a surface error. When a respective location in the plurality of locations has a surface error that meets the electrical breakdown threshold criteria, electrical breakdown occurs, whereby the electrical breakdown results in a discharging pulse that polishes the surface.
Information query
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