In one embodiment, an apparatus for optical communication and method of manufacturing is disclosed. An optical sub-assembly and optical platform may form the apparatus. Lasers contained in the hermetically sealed optical sub-assembly can be coupled to a modulator on the optical platform. The optical modulator can access an optical network using beams of light sent from the laser. In another embodiment, a method of manufacturing an optical communication device is disclosed. An optical sub-assembly and optical platform can form the optical communication device. Pre-defined break lines are placed on a carrier wafer. The wafer can accommodate a modulator sub-mount and a laser sub-mount. A tooling process is used to place the modulator sub-mount on an optical platform and the laser sub-mount adjacent to a thermo-electrical cooler. The laser sub-mount can be hermetically enclosed and aligned to communicate with the modulator sub-mount.