Invention Application
WO2015119737A1 INLINE DPS CHAMBER HARDWARE DESIGN TO ENABLE AXIS SYMMETRY FOR IMPROVED FLOW CONDUCTANCE AND UNIFORMITY
审中-公开
在线DPS室硬件设计，使轴向对称改进流动导通和均匀性
- Patent Title: INLINE DPS CHAMBER HARDWARE DESIGN TO ENABLE AXIS SYMMETRY FOR IMPROVED FLOW CONDUCTANCE AND UNIFORMITY
- Patent Title (中): 在线DPS室硬件设计，使轴向对称改进流动导通和均匀性
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Application No.: PCT/US2015/010652Application Date: 2015-01-08
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Publication No.: WO2015119737A1Publication Date: 2015-08-13
- Inventor: NGUYEN, Andrew , SARODE VISHWANATH, Yogananda , CHO, Tom K.
- Applicant: APPLIED MATERIALS, INC.
- Applicant Address: 3050 Bowers Avenue Santa Clara, California 95054 US
- Assignee: APPLIED MATERIALS, INC.
- Current Assignee: APPLIED MATERIALS, INC.
- Current Assignee Address: 3050 Bowers Avenue Santa Clara, California 95054 US
- Agency: PATTERSON, B. Todd et al.
- Priority: US61/936,423 20140206
- Main IPC: H01L21/02
- IPC: H01L21/02
Abstract:
The present disclosure generally relates to apparatus and methods for symmetry in electrical field, gas flow and thermal distribution in a processing chamber to achieve process uniformity. Embodiment of the present disclosure includes a plasma processing chamber having a plasma source, a substrate support assembly and a vacuum pump aligned along the same central axis to create substantially symmetrical flow paths, electrical field, and thermal distribution in the plasma processing chamber resulting in improved process uniformity and reduced skew.
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