Invention Application
- Patent Title: TEMPERATURE-BASED WIRE ROUTING
- Patent Title (中): 基于温度的电线路由
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Application No.: PCT/US2015/014770Application Date: 2015-02-06
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Publication No.: WO2015120244A1Publication Date: 2015-08-13
- Inventor: LIU, Chunchen
- Applicant: QUALCOMM INCORPORATED
- Applicant Address: ATTN: International IP Administration 5775 Morehouse Drive San Diego, California 92121-1714 US
- Assignee: QUALCOMM INCORPORATED
- Current Assignee: QUALCOMM INCORPORATED
- Current Assignee Address: ATTN: International IP Administration 5775 Morehouse Drive San Diego, California 92121-1714 US
- Agency: LOZA, Julio
- Priority: US14/175,429 20140207
- Main IPC: G06F17/50
- IPC: G06F17/50
Abstract:
A circuit design scheme routes wires based on temperature. In particular, temperature conditions along a prospective route are taken into account when determining whether to use that route for a wire. For example, a route can be selected from among a set of prospective routes based on which route is associated with the "smoothest" temperature gradient. Here, preference may be given to the route or routes having the smallest amount of temperature variation along the route.
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