Invention Application
WO2015183742A1 INTERCONNECT STRUCTURE WITH REDUNDANT ELECTRICAL CONNECTORS AND ASSOCIATED SYSTEMS AND METHODS
审中-公开
具有冗余电气连接器和相关系统和方法的互连结构
- Patent Title: INTERCONNECT STRUCTURE WITH REDUNDANT ELECTRICAL CONNECTORS AND ASSOCIATED SYSTEMS AND METHODS
- Patent Title (中): 具有冗余电气连接器和相关系统和方法的互连结构
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Application No.: PCT/US2015/032216Application Date: 2015-05-22
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Publication No.: WO2015183742A1Publication Date: 2015-12-03
- Inventor: CHANDOLU, Anilkumar
- Applicant: MICRON TECHNOLOGY, INC.
- Applicant Address: 8000 S. Federal Way, P.O. Box 6 Boise, ID 83707-0006 US
- Assignee: MICRON TECHNOLOGY, INC.
- Current Assignee: MICRON TECHNOLOGY, INC.
- Current Assignee Address: 8000 S. Federal Way, P.O. Box 6 Boise, ID 83707-0006 US
- Agency: TOLOMEI, John, G. et al.
- Priority: US14/287,418 20140527
- Main IPC: H01L25/065
- IPC: H01L25/065 ; H01L23/48
Abstract:
Semiconductor die assemblies having interconnect structures with redundant electrical connectors are disclosed herein. In one embodiment, a semiconductor die assembly includes a first semiconductor die, a second semiconductor die, and an interconnect structure between the first and the second semiconductor dies. The interconnect structure includes a first conductive film coupled to the first semiconductor die and a second conductive film coupled to the second semiconductor die. The interconnect structure further includes a plurality of redundant electrical connectors extending between the first and second conductive films and electrically coupled to one another via the first conductive film.
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