A silicon speaker comprising an MEMS acoustoelectric chip and a PCB substrate (3), wherein the MEMS acoustoelectric chip comprises a corrugated diaphragm (1) on a silicon substrate (2); and one side surface of the MEMS acoustoelectric chip is metalized, and the metalized side surface (6) of the MEMS acoustoelectric chip is connected with the PCB substrate. The corrugated diaphragm is electrically conductive and interconnected with metal paths (5) on MEMS acoustoelectric chip, which is led out to a first PCB metal path as one electrode. A second PCB metal path below the MEMS chip forms another electrode of the electrostatic actuator.