Invention Application
WO2016036874A1 SEMICONDUCTOR BONDING WITH COMPLIANT RESIN AND UTILIZING HYDROGEN IMPLANTATION FOR TRANSFER-WAFER REMOVAL
审中-公开
与合适的树脂结合的半导体和利用移植膜去除氢的植入
- Patent Title: SEMICONDUCTOR BONDING WITH COMPLIANT RESIN AND UTILIZING HYDROGEN IMPLANTATION FOR TRANSFER-WAFER REMOVAL
- Patent Title (中): 与合适的树脂结合的半导体和利用移植膜去除氢的植入
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Application No.: PCT/US2015/048176Application Date: 2015-09-02
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Publication No.: WO2016036874A1Publication Date: 2016-03-10
- Inventor: LAMBERT, Damien , SPANN, John , KRASULICK, Stephen
- Applicant: SKORPIOS TECHNOLOGIES, INC.
- Applicant Address: 5600 Eubank Boulevard NE Suite 200 Albuquerque, New Mexico 87111 US
- Assignee: SKORPIOS TECHNOLOGIES, INC.
- Current Assignee: SKORPIOS TECHNOLOGIES, INC.
- Current Assignee Address: 5600 Eubank Boulevard NE Suite 200 Albuquerque, New Mexico 87111 US
- Agency: CROOKSTON, Matthew B. et al.
- Priority: US62/046,500 20140905; US14/562,169 20141205
- Main IPC: H01L21/60
- IPC: H01L21/60
Abstract:
A transfer substrate with a compliant resin is used to bond one or more chips to a target wafer. An implant region is formed in a transfer substrate. A portion of the transfer substrate is etched to form a riser. Compliant material is applied to the transfer substrate. A chip is secured to the compliant material, wherein the chip is secured to the compliant material above the riser. The chip is bonded to a target wafer while the chip is secured to the compliant material. The transfer substrate and compliant material are removed from the chip. The transfer substrate is opaque to UV light.
Information query
IPC分类:
