Invention Application
- Patent Title: ELECTRODEPOSITION MEDIUMS FOR FORMATION OF PROTECTIVE COATINGS ELECTROCHEMICALLY DEPOSITED ON METAL SUBSTRATES
- Patent Title (中): 用于形成金属基板电化学保护涂层的电沉积介质
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Application No.: PCT/US2015/051731Application Date: 2015-09-23
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Publication No.: WO2016049191A1Publication Date: 2016-03-31
- Inventor: MALSHE, Vinod, Chintamani , JADHAV, Sameer, Shankar , SAWANT, Vitthal, Abaso , RANGANATHAN, Sathish, Kumar , DAVIS, Cody, R. , SIRIPURAPU, Srinivas , MHETAR, Vijay , ANDERSEN, Ryan, M.
- Applicant: GENERAL CABLE TECHNOLOGIES CORPORATION
- Applicant Address: 4 Tesseneer Drive Highland Heights, KY 41076 US
- Assignee: GENERAL CABLE TECHNOLOGIES CORPORATION
- Current Assignee: GENERAL CABLE TECHNOLOGIES CORPORATION
- Current Assignee Address: 4 Tesseneer Drive Highland Heights, KY 41076 US
- Agency: KUHNELL, Clayton, L. et al.
- Priority: US62/054,223 20140923
- Main IPC: B05D5/12
- IPC: B05D5/12
Abstract:
Articles including a conductive metal substrate and a protective coating on the metal substrate are provided. The protective coating is electro chemically deposited from an electrodeposition medium including a silicon alkoxide and quaternary ammonium compounds or quaternary phosphonium compounds. Methods of electro chemically depositing such protective coatings are also described herein.
Information query
