Invention Application
WO2016081868A1 MATING BACKPLANE FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTOR
审中-公开
用于高速，高密度电气连接器的背板
- Patent Title: MATING BACKPLANE FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTOR
- Patent Title (中): 用于高速，高密度电气连接器的背板
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Application No.: PCT/US2015/061930Application Date: 2015-11-20
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Publication No.: WO2016081868A1Publication Date: 2016-05-26
- Inventor: GAILUS, Mark, W. , CARTIER, Marc, B., Jr. , SIVARAJAN, Vysakh , LEVINE, David
- Applicant: AMPHENOL CORPORATION
- Applicant Address: 358 Hall Avenue Wallingford Center, CT 06492-3574 US
- Assignee: AMPHENOL CORPORATION
- Current Assignee: AMPHENOL CORPORATION
- Current Assignee Address: 358 Hall Avenue Wallingford Center, CT 06492-3574 US
- Agency: MCCLELLAN, William, R.
- Priority: US62/190,590 20150709; US62/082,905 20141121; US62/172,854 20150609; US62/172,849 20150609
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K1/14 ; H01R12/71
Abstract:
A printed circuit board includes a plurality of layers including attachment layers and routing layers; first and second signal vias forming a differential signal pair, the first and second signal vias extending through the attachment layers and connecting to respective signal traces on a breakout layer of the routing layers; an antipad of a first type around and between the first and second signal vias in one or more of the attachment layers; and antipads of a second type around the first and second signal vias in at least one routing layer adjacent to the breakout layer.
Information query
