Invention Application
WO2016094005A1 CARBON COMPOSITES HAVING HIGH THERMAL CONDUCTIVITY, ARTICLES THEREOF, AND METHODS OF MANUFACTURE
审中-公开
具有高导热性的碳复合材料，其制品及其制造方法
- Patent Title: CARBON COMPOSITES HAVING HIGH THERMAL CONDUCTIVITY, ARTICLES THEREOF, AND METHODS OF MANUFACTURE
- Patent Title (中): 具有高导热性的碳复合材料，其制品及其制造方法
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Application No.: PCT/US2015/059873Application Date: 2015-11-10
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Publication No.: WO2016094005A1Publication Date: 2016-06-16
- Inventor: ZHAO, Lei , XU, Zhiyue
- Applicant: BAKER HUGHES INCORPORATED
- Applicant Address: P.O. Box 4740 Houston, Texas 77210-4740 US
- Assignee: BAKER HUGHES INCORPORATED
- Current Assignee: BAKER HUGHES INCORPORATED
- Current Assignee Address: P.O. Box 4740 Houston, Texas 77210-4740 US
- Priority: US14/562,942 20141208
- Main IPC: C01B31/02
- IPC: C01B31/02 ; C23C16/26
Abstract:
A carbon composite comprises a binder and carbon microstructures having interstitial spaces among the carbon microstructures and voids within carbon microstructures; wherein the binder is disposed in the interstitial spaces among the carbon microstructures and the voids within the carbon microstructures. Alternatively, a carbon composite comprises carbon microstructures and a binder disposed in the interstitial spaces among the carbon microstructures, wherein the carbon microstructures comprise less than about 15 volume percent of voids within the carbon microstructures based on the total volume of the carbon microstructures.
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