Invention Application
- Patent Title: ASSEMBLY APPARATUS
- Patent Title (中): 装配装置
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Application No.: PCT/SG2016/050036Application Date: 2016-01-27
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Publication No.: WO2016126203A1Publication Date: 2016-08-11
- Inventor: WOON, Sin Wei , LIN, Wen Kai
- Applicant: ZIONTECH PTE LTD
- Applicant Address: 211 Woodlands Avenue 9, #07-75/76 Woodlands Spectrum II Singapore 738960 SG
- Assignee: ZIONTECH PTE LTD
- Current Assignee: ZIONTECH PTE LTD
- Current Assignee Address: 211 Woodlands Avenue 9, #07-75/76 Woodlands Spectrum II Singapore 738960 SG
- Agency: ONG, Jean Li, Magdelene
- Priority: SG10201500850S 20150204
- Main IPC: H01R43/00
- IPC: H01R43/00 ; B23P21/00 ; B23P19/02 ; B23P19/04
Abstract:
An assembly apparatus (10) is provided. The assembly apparatus (10) includes a first feeding mechanism (12) arranged in use to feed a series of first components (14), a holding mechanism (16) arranged in use to hold consecutive ones of the first components (14) in place, a cutter (18) arranged in use to separate individual ones of the first components (14) while being held in place by the holding mechanism (16), an inserter (20) arranged in use to push a separated first component (14) into a corresponding opening in a second component (22), and a drive mechanism (24) coupled to each of the first feeding mechanism (12), the holding mechanism (16), the cutter (18) and the inserter (20). The drive mechanism (24) is arranged in use to synchronise movement of the first feeding mechanism (12), the holding mechanism (16), the cutter (18) and the inserter (20).
Information query
