Invention Application
WO2016187011A2 METHODS FOR SURFACE PREPARATION OF SPUTTERING TARGET 审中-公开
溅射目标表面制备方法

METHODS FOR SURFACE PREPARATION OF SPUTTERING TARGET
Abstract:
Methods for finishing a sputtering target to reduce particulation and to reduce burn-in time are disclosed. The surface of the unfinished sputtering target is blasted with beads to remove machining-induced defects. Additional post-processing steps include dust blowing-off, surface wiping, dry ice blasting, removing moisture using hot air gun, and annealing, resulting in a homogeneous, ultra-clean, residual-stress-free, hydrocarbon chemicals-free surface.
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