Invention Application
- Patent Title: METHODS FOR SURFACE PREPARATION OF SPUTTERING TARGET
- Patent Title (中): 溅射目标表面制备方法
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Application No.: PCT/US2016/032370Application Date: 2016-05-13
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Publication No.: WO2016187011A2Publication Date: 2016-11-24
- Inventor: MA, Longzhou , YANG, Xingbo , STOJAKOVIC, Dejan , TESTANERO, Arthur V. , KOMERTZ, Matthew J.
- Applicant: MATERION CORPORATION
- Applicant Address: 6070 Parkland Boulevard Mayfield Heights, Ohio 44124 US
- Assignee: MATERION CORPORATION
- Current Assignee: MATERION CORPORATION
- Current Assignee Address: 6070 Parkland Boulevard Mayfield Heights, Ohio 44124 US
- Agency: KLEIN, Richard M.
- Priority: US62/162,173 20150515
- Main IPC: C23C14/34
- IPC: C23C14/34 ; H01J37/34
Abstract:
Methods for finishing a sputtering target to reduce particulation and to reduce burn-in time are disclosed. The surface of the unfinished sputtering target is blasted with beads to remove machining-induced defects. Additional post-processing steps include dust blowing-off, surface wiping, dry ice blasting, removing moisture using hot air gun, and annealing, resulting in a homogeneous, ultra-clean, residual-stress-free, hydrocarbon chemicals-free surface.
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