发明申请
WO2016190996A1 METHOD FOR ANCHORING A CONDUCTIVE CAP ON A FILLED VIA IN A PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD WITH AN ANCHORED CONDUCTIVE CAP
审中-公开
用于在印刷电路板和印刷电路板上填充导电盖的方法，其具有锚定导电盖
- 专利标题： METHOD FOR ANCHORING A CONDUCTIVE CAP ON A FILLED VIA IN A PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD WITH AN ANCHORED CONDUCTIVE CAP
- 专利标题（中）： 用于在印刷电路板和印刷电路板上填充导电盖的方法，其具有锚定导电盖
-
申请号： PCT/US2016/028600申请日： 2016-04-21
-
公开(公告)号： WO2016190996A1公开(公告)日： 2016-12-01
- 发明人: SIDHU, Rajwant , ZEPEDA, Ruben
- 申请人： TTM TECHNOLOGIES, INC.
- 申请人地址： 520 Maryville Centre, Suite 400 St. Louis, Missouri 63141 US
- 专利权人： TTM TECHNOLOGIES, INC.
- 当前专利权人： TTM TECHNOLOGIES, INC.
- 当前专利权人地址： 520 Maryville Centre, Suite 400 St. Louis, Missouri 63141 US
- 代理机构： DEAN, III, Elton F. et al.
- 优先权： US14/694,756 20150423
- 主分类号： H05K3/42
- IPC分类号： H05K3/42 ; H01L23/498 ; H05K3/32 ; H05K3/40 ; H05K3/46
摘要：
The present invention relates to forming an anchored cap in a filled via in a PCB. The cap is formed by making an anchor opening in the filled via, depositing cooper into the anchor opening to form an anchor portion, and subsequently depositing a cap portion over the filled via and the anchor portion, so that the anchored cap is anchored to the filled via by the anchor portion. In oanother embodiment, the anchor porition and cap portion may be deposited in one step.
