Invention Application
- Patent Title: BOND PADS WITH DIFFERENTLY SIZED OPENINGS
- Patent Title (中): 具有不同尺寸的开口的BOND PADS
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Application No.: PCT/US2016/044070Application Date: 2016-07-26
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Publication No.: WO2017027203A1Publication Date: 2017-02-16
- Inventor: VENKATADRI, Vikram
- Applicant: ANALOG DEVICES, INC,
- Applicant Address: One Technology Way Norwood, MA 02062 US
- Assignee: ANALOG DEVICES, INC,
- Current Assignee: ANALOG DEVICES, INC,
- Current Assignee Address: One Technology Way Norwood, MA 02062 US
- Priority: US14/821,228 20150807
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L23/31
Abstract:
Integrated circuit dies are provide with a passivation layer having a plurality of differently sized openings exposing bond pads for bonding. The sizes of the bond pads vary in a manner that at least partially compensates for stresses during bonding, such as flip chip thermocompression bonding, due to asymmetric distribution of bond pads.
Information query
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