Disclosed is a method for producing a bonded article (1), comprising providing a carrier substrate (2), having a bonding surface (2.1) and providing an ultra-thin substrate (3) which is sheet-like and flexible. The method further comprises cleaning at least the bonding surface of the ultra-thin substrate (3), cleaning at least the bonding surface of the carrier substrate (2), and establishing an intimate bonding. The method is characterized in that the intimate bonding is established by electrostatic forces resulting from a weak electrostatic field potential from electrostatic charges on at least one of the bonding surfaces, wherein the weak electrostatic field potential at the bonding surfaces does not exceed 1kV. Further disclosed are a bonded article and a use of the bonded article.