- 专利标题： SEMICONDUCTOR PACKAGE INTERCONNECT
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申请号： PCT/US2016/051230申请日： 2016-09-12
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公开(公告)号： WO2017048615A1公开(公告)日： 2017-03-23
- 发明人: KESER, Lizabeth Ann , ALVARADO, Reynante Tamunan
- 申请人： QUALCOMM INCORPORATED
- 申请人地址： ATTN: International IP Administration 5775 Morehouse Drive San Diego, California 92121-1714 US
- 专利权人： QUALCOMM INCORPORATED
- 当前专利权人： QUALCOMM INCORPORATED
- 当前专利权人地址： ATTN: International IP Administration 5775 Morehouse Drive San Diego, California 92121-1714 US
- 代理机构： OLDS, Mark E. et al.
- 优先权： US14/854,039 20150915
- 主分类号： H01L23/498
- IPC分类号： H01L23/498 ; H01L21/48
摘要：
A semiconductor package interconnect system may include a conductive pillar having a core (242), a first layer (244) surrounding the core (242), and a second layer (246) surrounding the first layer (244). The core (242) may be composed of a drawn copper wire, the first layer (244) may be composed of nickel, and the second layer (246) may be composed of a solder. A method for manufacturing a semiconductor package with such a conductive pillar may include placing a plurality of conductive pillars (240) on a substrate using a stencil process.
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