Invention Application
WO2017059141A1 PACKAGE-ON-PACKAGE (PoP) DEVICE COMPRISING A GAP CONTROLLER BETWEEN INTEGRATED CIRCUIT (IC) PACKAGES
审中-公开
包含集成电路（IC）封装中的间隙控制器的封装封装（PoP）器件
- Patent Title: PACKAGE-ON-PACKAGE (PoP) DEVICE COMPRISING A GAP CONTROLLER BETWEEN INTEGRATED CIRCUIT (IC) PACKAGES
- Patent Title (中): 包含集成电路（IC）封装中的间隙控制器的封装封装（PoP）器件
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Application No.: PCT/US2016/054552Application Date: 2016-09-29
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Publication No.: WO2017059141A1Publication Date: 2017-04-06
- Inventor: KUMAR, Rajneesh , KIM, Chin-Kwan , ROGGEMAN, Brian
- Applicant: QUALCOMM INCORPORATED
- Applicant Address: ATTN: International IP Administration 5775 Morehouse Drive San Diego, CA 92121-1714 US
- Assignee: QUALCOMM INCORPORATED
- Current Assignee: QUALCOMM INCORPORATED
- Current Assignee Address: ATTN: International IP Administration 5775 Morehouse Drive San Diego, CA 92121-1714 US
- Agency: THAVONEKHAM, S., Sean
- Priority: US62/236,696 20151002; US15/069,525 20160314
- Main IPC: H01L25/065
- IPC: H01L25/065
Abstract:
A package on package (PoP) device that includes a first package, a second package that is coupled to the first package, and at least one gap controller located between the first package and the second package, where the at least one gap controller is configured to provide a minimum gap between the first package and the second package. The first package includes a first electronic package component (e.g., first die). In some implementations, the at least one gap controller is coupled to the first package, but free of coupling with the second package. The at least one gap controller is located on or about a center of the first package. The at least one gap controller may be located between the first electronic package component (e.g., first die) and the second package. The package on package (PoP) device may include an encapsulation layer between the first package and the second package.
Information query
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