Invention Application
WO2017062095A1 SCALABLE THERMAL SOLUTION FOR HIGH FREQUENCY PANEL ARRAY APPLICATIONS OR OTHER APPLICATIONS
审中-公开
适用于高频面板阵列应用或其他应用的可扩展热解决方案
- Patent Title: SCALABLE THERMAL SOLUTION FOR HIGH FREQUENCY PANEL ARRAY APPLICATIONS OR OTHER APPLICATIONS
- Patent Title (中): 适用于高频面板阵列应用或其他应用的可扩展热解决方案
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Application No.: PCT/US2016/045928Application Date: 2016-08-06
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Publication No.: WO2017062095A1Publication Date: 2017-04-13
- Inventor: ELLIOTT, James M. , WILSON, James S. , SWERNOFSKY, David E.
- Applicant: RAYTHEON COMPANY
- Applicant Address: 870 Winter Street Waltham, Massachusetts 02451-1449 US
- Assignee: RAYTHEON COMPANY
- Current Assignee: RAYTHEON COMPANY
- Current Assignee Address: 870 Winter Street Waltham, Massachusetts 02451-1449 US
- Agency: MUNCK, William A. et al.
- Priority: US14/875,222 20151005
- Main IPC: H05K1/02
- IPC: H05K1/02
Abstract:
An apparatus includes a printed circuit board (PCB) (200, 200a-200m, 705) including a surface (205) that has a layer of circuitry (215, 220, 225, 230, 235, 240, 245, 250, 255, 260, 265, 709, 710). The apparatus also includes a heat sink (300) configured to receive heat from the PCB. The apparatus further includes a thermally- conductive post (400, 500, 707) configured to remove the heat from the PCB to the heat sink via thermal conduction through a thermal path. The thermal path is substantially orthogonal to the surface of the PCB. The post includes an end configured to physically couple to the layer of circuitry.
Information query
