Laser siping forms sipes in an article. The laser operates in a scan laser configuration for some sipe patterns and the laser operates in a fixed laser concept for other siping patterns. The article on which the sipes are formed is secured by a part holder. Movement of the part holder may be computer controlled. Movement of the laser may also be computer controlled. A movement of a reflective surface of the laser may be computer controlled. Together, the movement of the part holder, the laser, and the reflective surface is coordinated to achieve the scan laser configuration and the fixed laser configuration when forming sipes.