Invention Application
WO2017100575A1 ADJUSTED CAVITY INJECTION FLUID PRESSURES IN INJECTION MOLDING SYSTEM
审中-公开
注射成型系统中的调节腔注射流体压力
- Patent Title: ADJUSTED CAVITY INJECTION FLUID PRESSURES IN INJECTION MOLDING SYSTEM
- Patent Title (中): 注射成型系统中的调节腔注射流体压力
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Application No.: PCT/US2016/065832Application Date: 2016-12-09
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Publication No.: WO2017100575A1Publication Date: 2017-06-15
- Inventor: GALATI, Vito
- Applicant: SYNVENTIVE MOLDING SOLUTIONS, INC.
- Applicant Address: 10 Centennial Drive Peabody, MA 01960 US
- Assignee: SYNVENTIVE MOLDING SOLUTIONS, INC.
- Current Assignee: SYNVENTIVE MOLDING SOLUTIONS, INC.
- Current Assignee Address: 10 Centennial Drive Peabody, MA 01960 US
- Agency: OLIVERIO, M., Lawrence
- Priority: US62/265,098 20151209
- Main IPC: B29C45/77
- IPC: B29C45/77 ; B29C45/76 ; B29C45/28
Abstract:
An injection molding system (10) and method of use, where the system (10) comprises an injection molding machine (40), a controller (16) for controlling pack or fill pressures of an injection fluid (1153) injected during the pack and fill phases and a recorder, whereas the controller (16) includes instructions that control drive of actuators (1a, 2a, 3a, 4a) to effect an increase or decrease in fill and pack pressures of the injection fluid.
Information query
