Invention Application
- Patent Title: PRINTED CIRCUIT BOARDS
- Patent Title (中): 印刷电路板
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Application No.: PCT/US2016/015324Application Date: 2016-01-28
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Publication No.: WO2017131694A1Publication Date: 2017-08-03
- Inventor: NGUYEN, Vincent , KUO, Sung Hsia , LAI, Ho M
- Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
- Applicant Address: 11445 Compaq Center Drive West Houston, Texas 77070 US
- Assignee: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
- Current Assignee: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
- Current Assignee Address: 11445 Compaq Center Drive West Houston, Texas 77070 US
- Agency: ZHANG, Shu et al.
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K3/32
Abstract:
An example method includes linking a transmit line and receive line to a respective via, and printing two paths to each via, wherein each path is interrupted by two pairs of contacts. When a first resistor is in a first pair of contacts at a receive via, first signal is formed between a receive point of a first connector and the receive line. When a first capacitor is in first pair of contacts at a transmit via, second signal is formed between transmit point of first connector and the transmit line. When a second resistor is in second pair of contacts at receive via, third signal is formed between receive point of a second connector and the receive line. When a second capacitor is in second pair of contacts at transmit via, fourth signal is formed between a transmit point of second connector and the transmit line.
Information query