Invention Application
WO2018029315A2 MICROPATTERNING ASSEMBLY, METHODS FOR MICROPATTERNING, AND MICROPATTERNED DEVICES
审中-公开
微型组装，微型化和微型化装置的方法
- Patent Title: MICROPATTERNING ASSEMBLY, METHODS FOR MICROPATTERNING, AND MICROPATTERNED DEVICES
- Patent Title (中): 微型组装，微型化和微型化装置的方法
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Application No.: PCT/EP2017/070365Application Date: 2017-08-10
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Publication No.: WO2018029315A2Publication Date: 2018-02-15
- Inventor: SIXT, Michael , HAUSCHILD, Robert , SCHWARZ, Jan Alexander , NEMETHOVA, Maria
- Applicant: IST AUSTRIA - INSTITUTE OF SCIENCE AND TECHNOLOGY AUSTRIA
- Applicant Address: Am Campus 1 3400 Klosterneuburg AT
- Assignee: IST AUSTRIA - INSTITUTE OF SCIENCE AND TECHNOLOGY AUSTRIA
- Current Assignee: IST AUSTRIA - INSTITUTE OF SCIENCE AND TECHNOLOGY AUSTRIA
- Current Assignee Address: Am Campus 1 3400 Klosterneuburg AT
- Agency: GRUND, Martin
- Priority: EP16183929.5 20160812
- Main IPC: G01N33/543
- IPC: G01N33/543 ; C12M3/00 ; C12M1/12 ; C12N5/00 ; G01N33/569 ; G03F7/20
Abstract:
The present invention relates to the field of micropatterning. In particular, the present invention provides micropatterning assemblies and methods for micropatterning. Moreover, the present invention provides micropatterned devices obtained by using the micropatterning assemblies and/or methods of the invention. Furthermore, the present invention provides methods for using said devices.
Public/Granted literature
- WO2018029315A3 MICROPATTERNING ASSEMBLY, METHODS FOR MICROPATTERNING, AND MICROPATTERNED DEVICES Public/Granted day:2018-02-15
Information query
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